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a bibo:Issue;
dcterms:medium ;
rdau:P60049 ;
rdau:P60050 ;
rdau:P60048 ;
dc:identifier "(DE-101)1328626067";
umbel:isLike , ;
dcterms:language ;
a bibo:Article;
dc:title "Patterning roadmap: 2017 prospects";
dcterms:creator _:node1k0rmm5k0x23947647 .
_:node1k0rmm5k0x23947647 gndo:preferredName "Neisser, Mark" .
marcRole:aut _:node1k0rmm5k0x23947648 .
_:node1k0rmm5k0x23947648 gndo:preferredName "Neisser, Mark" .
bibo:pageStart "143";
bibo:pageEnd "148";
dcterms:extent "6 S.";
dcterms:isPartOf ;
dcterms:description "Abstract: Road mapping of semiconductor chips has been underway for over 20 years, first with the International Technology Roadmap for Semiconductors (ITRS) roadmap and now with the International Roadmap for Devices and Systems (IRDS) roadmap. The original roadmap was mostly driven bottom up and was developed to ensure that the large numbers of semiconductor producers and suppliers had good information to base their research and development on. The current roadmap is generated more top-down, where the customers of semiconductor chips anticipate what will be needed in the future and the roadmap projects what will be needed to fulfill that demand. The More Moore section of the roadmap projects that advanced logic will drive higher-resolution patterning, rather than memory chips. Potential solutions for patterning future logic nodes can be derived as extensions of ‘next-generation’ patterning technologies currently under development. Advanced patterning has made great progress, and two ‘next-generation’ patterning technologies, EUV and nanoimprint lithography, have potential to be in production as early as 2018. The potential adoption of two different next-generation patterning technologies suggests that patterning technology is becoming more specialized. This is good for the industry in that it lowers overall costs, but may lead to slower progress in extending any one patterning technology in the future."@de;
wdrs:describedby .
dcterms:license ;
dcterms:modified "2024-05-07T21:43:50.000"^^xsd:dateTime .
dcterms:issued "2017";
bibo:issue "6.2017, 3-4";
owl:sameAs .